AMPLab facilities

Concept laser M2 cusing system: selective laser melting (SLM)

• Argon atmosphere for the processing of reactive powder systems
• Net shape manufacture of fully dense components
• Build envelope 250 x 250 x 280mm
• Layer thickness 20 – 50µm
• Production speed 2 – 20cm3/hr (depending on material)
• Fiber laser system (400W, cw)
• Maximum scanning speed 7m/s
• Focus diameter 70 – 200µm

SLM solutons SLM500 HL: multi-laser large bed SLM

• 4 Lasers (2x 1kW + 2x400W) (cw)
• Build envelope 500 x 280 x 325 mm
• Layer thickness 20 – 200 μm
• Production speed 2 – 20 cm3/h
• Scanning speed 15 m/s
• Focus diameter 80 – 150/700 μm
• Parameters for Al, Ti, Ni, & Fe
• Heated substrate (200˚C)
• Powder spreading module

Trumpf direct laser fabrication (DLF) system

• Machine Limit – 1.5×1.0x3.0m
• Laser system Disk laser 4kW (Continuous and Pulsed Wave)
• Laser spot size: 0.4 – 6mm
• 5-axis CNC control movement
• Can be operated in powder and wire-fed deposition modes

EPSI hot isostatic press (HIP)

• Maximum pressure: 200MPa
• Maximum temperature: 1450°C
• Vessel size: Ø120mm x 300mm

HP 3D printer (fused deposition modelling)

Formlab stereolithography system

Vacuum and argon heat treatment furnaces

Wire electric discharge machining