Recreate toolbox

 Ultrasonic delamination​

•  Focused, high powered ultrasonic removes active materials enabling short-loop recycling to manufacture of new electrodes​

• Cost saving of 60% compared to using virgin material​

• 100 times greater yield per unit time and volume

• Samples can be be electrodissolved / chemically oxidised

• Electrocatalysis can be used

• Good for powdered samples​

• Even gold dissolves

• Recycling of printed circuit boards​

• Looking at inorganic eutectics (0.1x cost of most DESs)​

• Similar in fluidity to Ethaline​

• Using electrocatalyst to dissolve non-precious metals

Selective etchants​

• Develop etchants which target specific metals​

• Delamination occurs in <1h

Selective anti-solvents​

• Hybrid liquids can be developed which modify dissolution​

• Water can be added to a DES to increase copper dissolution (decreased viscosity) but stop silver dissolution (AgCl insoluble)

• Looking at oxidants which can be regenerated with air ​

• Aim to get delamination time < 1 min​

• Success with PCBs, PVs and thermoelectric devices

• ChCl brine enables the fastest etch rate for Ag​

• FeCl3 in water allowed selective removal of Al​

• 98% purity silver recovered and both liquids easily recycled

Biggest challenges in recycling are device architecture and bonding methods

• Structural adhesives prevent disassembly and repair​

• We have developed debondable adhesives that debond < 5 min​

• Applying to bonded magnets, battery modules and fibreglass​

Challenges​

• LCAs governed by solid: liquid ratio and high temperature processes​

• Separation better than shredding​

• Design is critical​

• Recycling is more efficient for more homogeneous feedstock i.e. PV and LIBs are easier than WEEE.​

• Polymer phases always complicate recycling flowsheet