AMPLab facilities
Concept laser M2 cusing system: selective laser melting (SLM)
![Concept Laser M2 Cusing System: Selective Laser Melting (SLM)](/Images/College-EPS-only/metallurgy/research/amplab/m2700x466.jpg)
- Argon atmosphere for the processing of reactive powder systems
- Net shape manufacture of fully dense components
- Build envelope 250 x 250 x 280mm
- Layer thickness 20 – 50µm
- Production speed 2 – 20cm3/hr (depending on material)
- Fiber laser system (400W, cw)
- Maximum scanning speed 7m/s
- Focus diameter 70 – 200µm
SLM solutons SLM500 HL: multi-laser large bed SLM
![SLM Solutions SLM500 HL: Multi-Laser Large Bed SLM](/Images/College-EPS-only/metallurgy/research/amplab/slm700x430.jpg)
- 4 Lasers (2x 1kW + 2x400W) (cw)
- Build envelope 500 x 280 x 325 mm
- Layer thickness 20 – 200 μm
- Production speed 2 – 20 cm3/h
- Scanning speed 15 m/s
- Focus diameter 80 – 150/700 μm
- Parameters for Al, Ti, Ni, & Fe
- Heated substrate (200˚C)
- Powder spreading module
Trumpf direct laser fabrication (DLF) system
![Trumpf Direct Laser Fabrication (DLF) System](/Images/College-EPS-only/metallurgy/research/amplab/trumpf700x466.jpg)
- Machine Limit – 1.5×1.0x3.0m
- Laser system Disk laser 4kW (Continuous and Pulsed Wave)
- Laser spot size: 0.4 – 6mm
- 5-axis CNC control movement
- Can be operated in powder and wire-fed deposition modes
EPSI hot isostatic press (HIP)
![Male researcher operating EPSI Hot Isostatic Press (HIP)](/Images/College-EPS-only/metallurgy/research/amplab/hip700x466.jpg)
- Maximum pressure: 200MPa
- Maximum temperature: 1450°C
- Vessel size: Ø120mm x 300mm
HP 3D printer (fused deposition modelling)
Formlab stereolithography system
Vacuum and argon heat treatment furnaces
Wire electric discharge machining
3D scanner