Manufacturing and device fabrication facilities

The Engineering Cleanroom Facility consists of an ISO 7 (class 10,000) cleanroom equipped for microlithography, and a supporting process room facility. Capabilities include:

  • Thin film, evaporation of metals including gold, silver, chrome, aluminium and zinc
  • Wet etch facilities and expertise
  • Wafer dicing
  • Plasma cleaning and surface functionalisation
  • Inert atmosphere curing and vacuum oven
  • Lapping/polishing
  • Ink jet printing (DIMATIX DMP-2850)
  • Photolithography at 4” wafer scale down to 10 micron resolution
  • Spin coating
  • Direct writing photolithography with 1 mm write field
  • Microscopy
  • Atomic force microscopy
  • Profilometry
  • Ball and wedge bonding and micro riveting
  • Contact angle measurements
Engineering cleanroom facility at University of Birmingham
The EDT clean room